High-speed Vision Inspection Module
Model: TEV-300

TEV-300 Main Image

Product Overview

TEV-300 can be installed on test-and-pack/taping machines and supports up to three independent cameras for high-speed dimensional checks, defect inspection, empty-pocket checks, and side-flip checks on tray/tape components. Inspection standards and dedicated software can be built from customer samples.

Why Choose TEV-300

<4ms
Vision processing time (MLCC type)
6,000 pcs/min
Maximum delayed displacement output speed
3 camera groups
Synchronous multi-station inspection

Key Features

  • 64-bit Windows 10/11 platform with stable and complete functionality.
  • Ultra-high-speed industrial camera + USB3.0 transfer, no dedicated capture card required.
  • Supports real-time image, brightness curve, zoom view, and rapid parameter switching.
  • Supports secondary imaging and delayed output with test-and-pack machines without affecting takt.

Implementation Flow

  1. Confirm machine interface signals, part type, and target takt.
  2. Establish inspection standards and judgment rules.
  3. On-machine sampling and speed validation.
  4. Go-live implementation and operator training.

Images

Hardware and Software Screens

TEV300_HW1 TEV300_HW2 TEV300_SW1 TEV300_SW2 TEV300_SW3

Technical Specifications

  • Image processing time: approx. 4ms (MLCC-type products)
  • Maximum immediate output speed: approx. 3,000 pcs/min
  • Maximum delayed output speed: approx. 6,000 pcs/min

Applications and Inspection Items

  • Applications: MLCC, MLCI, resistors, inductors, diodes, LEDs, QFN, etc.
  • Inspection: size/pitch measurement, electrode-shape defects, body contamination/cracks, marking checks, and color-difference checks.

Resources

Use Cases

Implementation Experience | High-Speed Vision Upgrade for Test-and-Pack Machines

A common need is improving detection rate without slowing down. Multi-camera task split and delayed-displacement output balance takt and judgment stability.

FAQ

Can it be installed on existing test-and-pack machines?

Yes. We first evaluate I/O and trigger-feedback interfaces, then plan implementation.

Can inspection items be customized?

Yes. Inspection standards and dedicated workflows can be built from samples and defect definitions.